Published in: BMS IC WIRE TO WIRE PIP/PIH-through hole reflow soldering WIRE TO WIRE Les services de paiement sont disponibles via des applications mobiles et de bureau. Drawing(PDF) Series drawing Product Specification Contact us datadataProduct SubcategoryA0501Series Product Pitch0.50mm(.020in)Material - Resin and FlammabilityPhosphor BronzePlatingGold (Au) Plating